Electronic device and a method of manufacturing the same
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United States of America Patent
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Mar 21, 2006
Issued Date -
N/A
app pub date -
Mar 2, 2004
filing date -
Aug 31, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacturing an electronic device including a first electronic component mounted on one main surface of a wiring board by being thermo-compression bonded by means of a thermo-compression bonding tool with an adhesive resin interposed between a first area of the one main surface of the wiring board and the first electronic component, and a second electronic component mounted on a second area different from the first area of the one main surface of the wiring board by melting a soldering paste material and higher than the first electronic component in post-mounting height, and wherein the first electronic component is mounted before the mounting of the second electronic component.
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