Thin surface mounted type solid electrolytic capacitor
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United States of America Patent
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Mar 14, 2006
Issued Date -
N/A
app pub date -
Jun 28, 2004
filing date -
Jul 18, 2002
priority date (Note) -
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Abstract
An external cathode terminal (16) is adhered to one surface of a capacitor element while a prepreg (25) is adhered to another surface of the capacitor element. A reinforcement plate (26) is adhered to the prepreg. Heat and pressure are applied to the external cathode terminal, the prepreg, and the reinforcement plate to elute thermosetting resin from the prepreg in the side of the capacitor element, thereby sealing the side of the capacitor element with eluted material (27A, 27B). Inasmuch as transfer molding is not used as exterior package, the element never deforms by injection pressure of resin. It is possible to thin by a thickness of exterior package resin. Inasmuch as eluted thermosetting resin does not include a mold release agent, it has good adhesion for the external cathode terminal.
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