METHOD OF FORMING A WAFER BACKSIDE INTERCONNECTING WIRE
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United States of America Patent
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Mar 7, 2006
Grant Date -
Mar 16, 2006
app pub date -
Nov 19, 2004
filing date -
Sep 10, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A method of forming a wafer backside interconnecting wire includes forming a mask layer on the back surface, the mask layer including at least an opening corresponding to the bonding pad, performing a first etching process from the back surface to remove the wafer unprotected by the mask layer to form a recess, removing the mask layer, and forming an interconnecting wire on the back surface.
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