Sputtering device
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United States of America Patent
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Mar 7, 2006
Grant Date -
Nov 25, 2004
app pub date -
Aug 27, 2003
filing date -
May 14, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
An object of the invention is to provide a sputtering device which can provide increased distribution of film formation and coverage distribution better than prior sputtering devices. Thus, this invention is that, in the sputtering device constituted of a substrate holder for holding a substrate, at least one target for forming a thin film on the substrate, at least one sputtering cathode which has the target and magnets arranged behind the substrate, an axis of the target is inclined to an axis of the sputtering cathode, and the sputtering cathode is rotated on its axis to make the target swing relative to the substrate.
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