Method and apparatus for joining substrates
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United States of America Patent
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Mar 7, 2006
Grant Date -
Mar 18, 2004
app pub date -
Dec 13, 2001
filing date -
Jan 8, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In order to reduce cycle times for assembling at least two substrates (3,4) in order to form an optical data carrier in a low-pressure chamber (8), a method and a device are disclosed wherein an opening (11) of the low-pressure chamber is sealed in relation to the surrounding environment, the low-pressure chamber is pumped out, a transfer chamber (64) is formed between a first handling device (16) arranged in the low-pressure chamber and a second handling device (24) arranged outside the low-pressure chamber by respectively sealing the opening (11) of the low-pressure chamber (8). The transfer chamber (64) has a smaller volume than that of the low-pressure chamber (8); the substrates (3, 4) in the transfer chamber (64) are transferred from the second handling device (24) to the first handling device (16); the substrates are conveyed (3, 4) with the first handling device (16) to an assembly station (14) in the low-pressure chamber when low-pressure chamber is sealed by the second handling device (24), and the substrates (3,4) are assembled in the assembly station (14).
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