Cement bonded wood chip product, resin bonded wood chip product, simulated wood product

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United States of America Patent

PATENT NO 7005463
SERIAL NO

09799560

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Abstract

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A simulated wood product is molded by either extrusion or injection molding. This product has pulverized powders obtained from recycled building members. These members include recycled wooden members made of wooden materials and recycled resinous members also made of wooden materials. The pulverized powders include recycled wooden members and recycled resinous members in a mixed state by mixing and pulverizing the recycled wooden members and recycled resinous members together.

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Patent Owner(s)

Patent OwnerAddress
MISAWA HOMES CO LTDTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Taguchi, Hidenori Suginami-ku, JP 15 203
Umemura, Keishiro Suginami-ku, JP 2 63

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