Method and apparatus for shielding integrated circuits
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United States of America Patent
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Feb 28, 2006
Grant Date -
Nov 10, 2005
app pub date -
Jun 16, 2005
filing date -
Sep 27, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Some embodiments of the invention cover the top of a flip chip IC with a conductive adhesive material. This material is used in place of a shielding metal can or plate in some embodiments, while it is used in conjunction with such metal can or plate in other embodiments of the invention. Also, some embodiments use a printing technique to coat the top of the flip chip with the conductive adhesive material. In some embodiments, the coating material is a silver paste.
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