Molding die and molding method
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United States of America Patent
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-
Feb 28, 2006
Grant Date -
Nov 20, 2003
app pub date -
May 15, 2003
filing date -
May 15, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The transfer plate is energized and heated uniformly in the state in which the transfer plate heated through the electric resistance heating is separated slightly from the specular surface of the specular plate, then, immediately before the die is closed, the transfer plate is pressed against the specular surface to adhere thereto and, at the same time, the resin material is supplied to the cavity quickly and, after that, at the same time as the molded product is shaped completely, the transfer plate is de-energized so that the resin material in the cavity is quenched at the controlled temperature of the specular plate that is set to be lower than the heating temperature of the transfer plate.
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