Device and method for aligning disk-shaped substrates
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United States of America Patent
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Feb 28, 2006
Grant Date -
Nov 21, 2002
app pub date -
Nov 29, 2000
filing date -
Dec 1, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a simple and cost-effective method for aligning substrates. In order to achieve this, the invention provides a device for aligning disc-shaped substrates, in particular semiconductor wafers, comprising an alignment detection unit, at least one first support for receiving the substrate, which forms an oblique plane in relation to the horizontal, a stop against which the substrate can be displaced as a result of the oblique angle and a rotational device for rotating the substrate. The invention also relates to a method for aligning disc-shaped substrates, in particular semiconductor wafers, comprising the following steps: displacement of the substrate into an oblique position in relation to the horizontal, in which the substrate is held on a support which forms a tilted plane in relation to the horizontal and lies against a stop as a result of the oblique angle; rotation of the substrate into a predefined rotational position; and monitoring of the rotational position using a detection unit.
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