Capillary with contained inner chamfer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 28, 2006
Issued Date -
N/A
app pub date -
Jan 18, 2005
filing date -
Jul 17, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed in the bonding tool.
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