Kinetic sprayed electrical contacts on conductive substrates
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United States of America Patent
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Feb 21, 2006
Grant Date -
Apr 15, 2004
app pub date -
Oct 1, 2003
filing date -
Oct 9, 2001
priority date (Note) -
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Abstract
The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form direct mechanical bonds between the particles and the conductors in a pre-selected location and particle number density that promotes high surface-to-surface contact and reduced contact resistance between the conductors.
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