Apparatus and method for inter-chip or chip-to-substrate connection with a sub-carrier
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United States of America Patent
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Feb 14, 2006
Issued Date -
N/A
app pub date -
Dec 2, 2002
filing date -
Nov 30, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is directed to a method and an apparatus where the standard wire bonding of TBGA's is replaced using a solid intermediate subcarrier on which the die may be flip chipped and which may then be flip chipped onto the substrate. The subcarrier has a number of conductors replacing the wire bond. In this manner, a better reflection suppression, better impedance matching, smaller conductor pitch and other advantages are achieved. The subcarrier may also be used for mounting multiple dies in a single substrate.
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