Metal-bonded grinding tool
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United States of America Patent
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Feb 7, 2006
Grant Date -
Mar 4, 2004
app pub date -
Aug 26, 2003
filing date -
Aug 27, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A metal-bonded grinding tool including a base and abrasive grains bonded to the base by means of a metal bond matrix containing a Cu alloy as a main component. A content of at least one of an alloy phase, a mixed phase, and an intermetallic compound of Zr and Ti in the metal bond matrix is in a range of 3.8 to 19.2 wt %.
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