Embossing system to be used with a die press
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United States of America Patent
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Feb 7, 2006
Grant Date -
Jun 24, 2004
app pub date -
Sep 16, 2003
filing date -
Sep 16, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Disclosed is an embossing system to be used with a die press. The embossing system includes a force transfer assembly, which comprises a first cover and an opposite second cover with the first and second covers being connected by a hinge. The force transfer assembly further includes a stencil and an opposing form positioned internal of the force transfer assembly. The stencil and the form are adapted to sandwich an embossing material, such as paper, between the stencil and the form. The embossing system further includes a layer of static vinyl that is located internally of one of the covers to secure the form to the internal side of one of the covers. The embossing system also utilizes an adhesive located on the cover opposite the cover with the vinyl to secure the stencil to the internal side of the opposite cover.
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