Sputtering target assemblies using resistance welding
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United States of America Patent
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Jan 31, 2006
Grant Date -
Jan 20, 2005
app pub date -
Jul 15, 2003
filing date -
Jul 15, 2003
priority date (Note) -
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Abstract
A method of forming a sputtering target assembly and other metal articles is described. Sputtering target assemblies and metal articles are also described. The method includes bonding a sputter target to a backing plate using resistance heating or welding to bond assembly members that respectively include mating projections and grooves formed in bonding surfaces thereof.
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