Cup type plating apparatus
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United States of America Patent
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Jan 31, 2006
Issued Date -
N/A
app pub date -
Mar 5, 2002
filing date -
Mar 23, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A cup type plating apparatus in which plating is carried out by supplying plating solution to a wafer placed on an opening at a top of a plating tank while an anode and the wafer connected to a cathode provided in the plating tank are electrically connected, and the anode and the cathode are separated by diaphragm provided in the plating tank, provided with a division wall between the anode and the wafer formed in a shape capable of separating the anode and the wafer from each other and having a plurality of openings covered with diaphragm. The concentration of the plating solution supplied to the plating tank separated by the division wall is made to be appropriately controllable. Further, a unit for stirring is provided capable of forcibly altering the flow of plating solution at the target surface of plating.
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