Electroless displacement gold plating solution and additive for use in preparing plating solution
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United States of America Patent
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Jan 31, 2006
Grant Date -
Feb 10, 2005
app pub date -
Aug 21, 2001
filing date -
Aug 21, 2000
priority date (Note) -
Expired
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Abstract
An object of the present invention is to provide an electroless displacement gold plating solution, an additive for use in preparing the plating solution, and a metal composite material obtained by treatment with the plating solution. The electroless displacement gold plating solution contains a water-soluble gold compound, a complexing agent, and a water-soluble silver compound, and optionally a water-soluble thallium compound, a water-soluble lead compound, a water-soluble copper compound or a water-soluble nickel compound, or any combination thereof. The plating solution has good stability and, even not only immediately after the preparation but also after a lapse of a certain time period from the preparation, can be used for production of a metal composite material exhibiting an even plated appearance and also having a thick gold coating film.
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