Process for manufacturing multilayer flexible wiring boards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 31, 2006
Issued Date -
N/A
app pub date -
Apr 28, 2003
filing date -
Aug 26, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The multilayer flexible wiring board includes first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer. The resin film is adapted to form an opening when the bump is forced into the resin film and an ultrasonic wave is applied to the bump. The bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully