Solder printing using a stencil having a reverse-tapered aperture
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United States of America Patent
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-
Jan 24, 2006
Grant Date -
Dec 4, 2003
app pub date -
May 29, 2002
filing date -
May 17, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A stencil used for printing solder paste on a contact pad of a printed wiring board has one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the apertures) than at the board side of the stencil (i.e., where the stencil contacts the contact pad of the printed wiring board).
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