Method and system for testing multi-chip integrated circuit modules
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United States of America Patent
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Jan 10, 2006
Grant Date -
May 19, 2005
app pub date -
Nov 13, 2003
filing date -
Nov 13, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A system and method for utilizing a multi-probe tester to test an electrical device having a plurality of contact pads. Multi-probe tester test probes and electrical device contact pads are arrayed in a common distribution pitch, wherein at least one test probe is masked, thereby preventing the at least one test probe from returning a test result to the testing apparatus. In one embodiment mask membrane physically prevents at least one test probe from making contact with the electrical device. In another embodiment at least one software command is provided configured to cause an input from at least one test probe to be disregarded during a test routine. Another embodiment features both mask membrane and software command probe masking.
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