Heatsink arrangement for semiconductor device
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United States of America Patent
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Jan 10, 2006
Grant Date -
Aug 26, 2004
app pub date -
Dec 18, 2003
filing date -
Feb 24, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A heatsink arrangement attached to a semiconductor device includes: a first heatsink placed in close contact with the semiconductor device; and second heatsink placed in close contact with the first heatsink, wherein the first heatsink and the second heatsink are connected to a power supply circuit for the semiconductor device via first connector and second connector, respectively. Thus, the present invention provides a heatsink arrangement for a semiconductor device used in an electric/electronic circuit that radiates less high-frequency noise even when a large current flows through the semiconductor device and that provides a high heat-radiating efficiency.
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