Apparatus for manufacturing synthetic resin hollow member incorporating an intermediate element therein
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 3, 2006
Issued Date -
N/A
app pub date -
Aug 10, 2001
filing date -
Nov 14, 1997
priority date (Note) -
Expired
status (Latency Note)
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Importance

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Abstract
Method and apparatus for manufacturing a synthetic resin-made hollow member incorporating an intermediate element are provided which enable operations of molding half bodies, abutting and joining the half bodies together, and molding an intermediate element in a series of steps, and which eliminate the necessity of such a manual work as may otherwise be required in incorporating the intermediate element into the half bodies. A pair of rotary injection molding dies are used which can be opened and closed relative to each other and are rotatable relative to each other over an angle of 60° for each turn, each die having a half body molding section including one male molding portion and two female molding portions in the direction of rotation for each rotational run over an angle of 120°, each die also having an intermediate element molding portion provided between specified half body molding portions in the direction of each rotational run over an angle of 120°. In each two rotational runs of the molding dies, a series of steps is carried out including first injection for molding a pair of half bodies and an intermediate element, molded product setting for matching two half bodies with the intermediate element set in place and abutting the two half bodies against each other, and second injection for injecting melted resin onto the abutting portions and joining the two half bodies, whereby a hollow member with the intermediate element set between the two half bodies can be obtained.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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DAIKYONISHIKAWA CORPORATION | HIGASHIHIROSHIMA-SHI HIROSHIMA 739-0049 |
International Classification(s)

- 2001 Application Filing Year
- B29C Class
- 1881 Applications Filed
- 684 Patents Issued To-Date
- 36.37 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Nishida, Shoso | Hiroshima, JP | 37 | 118 |
# of filed Patents : 37 Total Citations : 118 | |||
Takemoto, Yoshihiro | Higashihiroshima, JP | 21 | 128 |
# of filed Patents : 21 Total Citations : 128 |
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Patent Citation Ranking
- 9 Citation Count
- B29C Class
- 4.08 % this patent is cited more than
- 19 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
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Feb 23, 2024 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 12TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1553); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 12 |
Mar 31, 2020 | I | Issuance | |
Jul 31, 2017 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZBORAY, DAVID ANTHONY;BENNETT, MATTHEW ALAN;WALLACE, MATTHEW WAYNE;AND OTHERS;SIGNING DATES FROM 20090824 TO 20091016;REEL/FRAME:043141/0211 Owner name: LINCOLN GLOBAL, INC., CALIFORNIA |
Jan 05, 2015 | F | Filing |

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