Cooling apparatus having low profile extrusion and method of manufacture therefor
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United States of America Patent
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Jan 3, 2006
Grant Date -
Jul 10, 2003
app pub date -
Dec 31, 2002
filing date -
Jun 8, 1999
priority date (Note) -
Expired
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Abstract
A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. In the caps interconnect the ends of the micro tubes in fluid communications and to inlet and outlet tubes. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid is circulated through the micro tubes of the low profile extrusion, and a heat exchanger removes the heat from the heat transfer fluid.
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