Process for producing an SPM sensor
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United States of America Patent
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Dec 27, 2005
Grant Date -
Oct 23, 2003
app pub date -
Mar 10, 2003
filing date -
Mar 20, 2002
priority date (Note) -
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Abstract
Process for producing an SPM sensor having a holding element, a cantilever and a sensor tip which projects out of the surface of the cantilever and is delimited by three surfaces. According to the process, the starting material used is a (100)-silicon wafer. The main patterning process steps are carried out on the wafer back surface, so that an SPM sensor can be produced at low cost in a single batch run.
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