Surface mounting package
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United States of America Patent
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-
Dec 20, 2005
Grant Date -
Sep 9, 2004
app pub date -
Sep 12, 2002
filing date -
Sep 14, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A surface mounting package includes a metal base with a lower surface having a through hole, a metal lead arranged to be inserted into the through hole, an insulating material filling in an internal space defined by the metal base, a cap covering the metal base as a lid, and an electronic part component arranged at a surface on the internal space side of the metal lead. The internal space is held at an air-tight atmosphere. The metal base has a lower surface positioned on the same plane as a lower surface of the metal lead or the insulating material, the same plane forming a plane to be attached to a mounting board.
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