Method for electrolytic copper plating
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United States of America Patent
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Dec 20, 2005
Grant Date -
Nov 4, 2004
app pub date -
Nov 26, 2003
filing date -
Nov 28, 2002
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Abstract
A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen atom, and X and Y may be the same only when they are a carbon atom, and by contacting the electrolytic copper plating solution with ozone is disclosed.
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