Semiconductor device and chip carrier
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United States of America Patent
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Dec 13, 2005
Grant Date -
Aug 8, 2002
app pub date -
Feb 1, 2002
filing date -
Feb 5, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There are provided a carrier substrate, a temperature sensing resistor film formed directly on the carrier substrate, first and second conductive patterns formed on the carrier substrate and connected to both ends of the temperature sensing resistor film respectively, and a semiconductor chip mounting region portion formed on the carrier substrate.
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