Fabrication method of semiconductor integrated circuit device and testing method
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United States of America Patent
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Dec 13, 2005
Issued Date -
N/A
app pub date -
Sep 26, 2003
filing date -
Mar 16, 2001
priority date (Note) -
Expired
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Abstract
A method of fabricating a semiconductor integrated circuit device includes performing a wafer process to a plurality of wafers so as to form a plurality of semiconductor integrated circuit devices over each of the wafers, performing a first electrical test to a first set of wafers selected from the plurality of wafers formed in the wafer process and accommodated in a first wafer cassette placed in a wafer prober, and performing a second electrical test to a second set of wafers selected from the plurality of wafers formed in the wafer process and accommodated in a second wafer cassette placed in the wafer prober by automatically changing a test object to the second set of wafers.
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