Electronic component having lead frame
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United States of America Patent
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Dec 6, 2005
Grant Date -
Jun 17, 2004
app pub date -
Dec 3, 2003
filing date -
Dec 12, 2002
priority date (Note) -
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Abstract
An electronic component has a lead frame attached to an element with a conductive adhesive. The lead frame has one of a hole, cavity, cutout and groove filled with the adhesive. The lead frame may be provided with a plurality of grooves intersecting one another and divided into frame segments by the grooves.
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