Ceramic heat sink with micro-pores structure
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United States of America Patent
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Nov 22, 2005
Grant Date -
Mar 3, 2005
app pub date -
Aug 29, 2003
filing date -
Aug 29, 2003
priority date (Note) -
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Abstract
A ceramic heat sink having a micro-pores structure includes a thermal conductive layer mounted on a surface of a heat source to absorb heat from the heat source, a heat dissipation layer combined with the thermal conductive layer and having a micro-pores structure with hollow crystals to provide a relatively greater surface area, and a cooling fan mounted on the heat dissipation layer to provide a forced convection effect. Thus, the micro-pores structure can increase the contact surface area between the heat sink and the air, thereby enhancing the heat dissipation effect of the ceramic heat sink.
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