Tape-packaged headed pin contact
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United States of America Patent
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Nov 22, 2005
Grant Date -
N/A
app pub date -
Aug 12, 2002
filing date -
Aug 12, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A non-intrusive surface mount interconnect that provides a through-hole interconnect to the opposite side of a PCB board. A headed pin (head up/shank down) can be picked by standard placement equipment from a specially configured pocket tape using a hole that is tightly controlled for pin location. The head of the pin rests on top of the packaging tape preventing the pin from passing through the hole. A tapered section on the pin fits with minimal clearence assuring that a vacuum nozzle on the placement equipment when it descends sees and contacts the head top for vacuum nozzle pick-up.
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