Device for thermally treating substrates
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United States of America Patent
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Nov 15, 2005
Grant Date -
May 13, 2004
app pub date -
Sep 14, 2001
filing date -
Oct 16, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The aim of the invention is to enable substrates to be thermally treated in a more homogeneous manner. In order to achieve this, a device is provided for thermally treating substrates, especially semiconductor wafers, comprising at least two adjacent, essentially parallel heating elements which respectively have at least one heating wire. The two adjacent heating elements are embodied in such a way that they are quasi-complementary, at least in parts, in terms of the coiled and uncoiled segments of the heating wires pertaining thereto.
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