Three-dimensional nonwoven substrate for circuit board
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United States of America Patent
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Nov 15, 2005
Grant Date -
Jan 9, 2003
app pub date -
Jun 4, 2002
filing date -
Jun 4, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to a nonwoven substrate, and specifically to a nonwoven substrate imparted with a three-dimensional image, wherein the three-dimensional nonwoven substrate is particularly suited as a support substrate for a PCB (Printed Circuit Board) and similar application. By the utilization of a hydroentangled, three-dimensionally imaged support substrate impregnated with a durable resinous matrix, PCB's, and similar applications, can be imparted with unique and useful performance properties, to improve structural performance.
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