Combination thermal wave and optical spectroscopy measurement systems
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United States of America Patent
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Nov 8, 2005
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N/A
app pub date -
Oct 22, 2003
filing date -
Feb 8, 2000
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Abstract
A combination metrology tool is disclosed which is capable of obtaining both thermal wave and optical spectroscopy measurements on a semiconductor wafer. In a preferred embodiment, the principal combination includes a thermal wave measurement and a spectroscopic ellipsometric measurement. These measurements are used to characterize ion implantation processes in semiconductors over a large dosage range.
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