Microelectromechanical device using resistive electromechanical contact
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United States of America Patent
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Nov 8, 2005
Issued Date -
N/A
app pub date -
Aug 29, 2002
filing date -
Jun 4, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A microelectromechanical device that transmits an electric signal using mechanical contact between conductors is provided. The microelectromechanical device has a conductive oxide layer on at least one of contacting surfaces of the conductors. The conductor may be a signal line or a contact pad. According to the microelectromechanical device, the signal line or the contact pad is coated with the conductive oxide layer, thereby preventing the occurrence of micro-welding problem due to resistive heat. As a result, a reliability and a power handling of a microelectromechanical device can be improved.
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