Photosensitive resin composition, process for forming relief pattern, and electronic component
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United States of America Patent
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Nov 1, 2005
Grant Date -
Jul 22, 2004
app pub date -
Nov 6, 2003
filing date -
Nov 6, 2002
priority date (Note) -
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Abstract
A photosensitive resin composition is disclosed that includes (A) a heat-resistant polymer of the general formula (1): ##STR1## (where the symbols are as defined in the specification), (B) a photoreactive compound, and (C) a solvent. A relief pattern is formed from the composition by applying the composition to a support substrate and drying it to form a photosensitive resin film; exposing the dried film; developing the exposed film using an alkaline aqueous solution; and heating the developed photosensitive resin film. Also disclosed is an electronic component that includes an electronic device having such a pattern.
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