Combined boards and methods for manufacturing the same
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United States of America Patent
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Nov 1, 2005
Grant Date -
Sep 11, 2003
app pub date -
Feb 5, 2003
filing date -
Feb 6, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
Combined boards are taught that comprise a second board substrate (12) having a through bore (14) formed therein, a first board substrate (10), and a connector pin (40, 50) received in the through bore (14) of the second board substrate (12). The first and second board substrates overlap such that the through bore (14) of the second board substrate (12) is covered by a first surface (10b) of the first board substrate (10). The connector pin is fusion bonded to a circumferential surface of the through bore (14) and the first surface (10b) of the first board substrate (10).
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