Combined boards and methods for manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6960383
APP PUB NO 20030170422A1
SERIAL NO

10358766

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Combined boards are taught that comprise a second board substrate (12) having a through bore (14) formed therein, a first board substrate (10), and a connector pin (40, 50) received in the through bore (14) of the second board substrate (12). The first and second board substrates overlap such that the through bore (14) of the second board substrate (12) is covered by a first surface (10b) of the first board substrate (10). The connector pin is fusion bonded to a circumferential surface of the through bore (14) and the first surface (10b) of the first board substrate (10).

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Patent Owner(s)

Patent OwnerAddress
ARACO KABUSHIKI KAISHA25 KAMIFUJIIKE YOSHIWARA-CHO TOYOTA-SHI AICHI-KEN 473-8512

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Heta, Hitoshi Toyota, JP 1 5
Kondo, Toshiaki Okazaki, JP 44 1112
Nagaya, Tamotsu Toyota, JP 4 16
Suzuki, Makoto Okazaki, JP 488 4914
Uchida, Masahiko Okazaki, JP 9 13

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges53685282123482918155431501 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050100150200250300350400450500550600650700750

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