Method for producing a substrate arrangement
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United States of America Patent
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Oct 18, 2005
Grant Date -
Dec 25, 2003
app pub date -
Jun 26, 2002
filing date -
Jun 26, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A method is provided for producing a substrate arrangement. The process includes the preparation of a substrate and bringing connecting surfaces of the substrate into contact with inner contacts of a wiring layer, the application of contact material to outer contacts of the wiring layer defining an outer connecting surface arrangement to form base contact bumps (31) and the application of joining material to the base contact bumps to form contact bump tops joined to the base contact bumps, wherein the joining material is applied as joining material moldings (35) and the contact bump tops are formed by at least partial melting of the joining material moldings by the action of laser energy.
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