Production of laminates for printed wiring boards using protective carrier
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United States of America Patent
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-
Oct 18, 2005
Grant Date -
Jul 10, 2003
app pub date -
Jan 10, 2002
filing date -
Jan 10, 2002
priority date (Note) -
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Abstract
A laminate to be used in the manufacture of printed circuit boards is formed by contacting one surface of a layer of a conductive foil (e.g. copper foil) with protective-carrier sheeting (e.g., aluminum foil) and the other surface of the conductive foil with a dielectric layer (e.g., prepreg). The contacted layers are stacked and cut to desired dimensions. The process is performed without use of adhesive or mechanical attachment. Consequently, contamination and the occurrence of imperfections in the conductive foil of a laminate to be used in a printed wiring board can be substantially reduced.
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