Substrate treatment apparatus

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United States of America Patent

PATENT NO 6955178
SERIAL NO

10626517

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate treatment apparatus includes a substrate heating device for maintaining a substrate at a temperature higher than room temperature, a wetting device for producing a wet ozone-containing gas by wetting an ozone-containing gas with a treatment solution, and a supply device for supplying the wet ozone-containing gas from the wetting device to a work object on a surface of the substrate. The supply device includes a gas disperser including apertures aligned in rows in a width direction of the work object. The apertures in adjacent rows are not aligned with each other in a direction perpendicular to the rows. At least one of the gas disperser and the substrate is movable in a direction perpendicular to the rows. A gas conduit connects the wetting device to the supply device. A wet ozone-containing gas heating device heats the wet ozone-containing gas to a temperature at least equal to the temperature of the substrate.

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Patent Owner(s)

Patent OwnerAddress
STERLING INTERNATIONAL INC3808 NORTH SULLIVAN ROAD BLDG 16 SPOKANE WA 99216

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Horibe, Hideo Tokyo, JP 11 86
Kataoka, Tatsuo Shizuoka, JP 26 392
Kuzumoto, Masaki Tokyo, JP 43 770
Miyamoto, Makoto Tokyo, JP 141 991
Noda, Seiji Tokyo, JP 31 230
Oishi, Tetsuji Shizuoka, JP 7 31
Oya, Izumi Tokyo, JP 7 67

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