Method for fabricating electrical connecting element
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United States of America Patent
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Oct 18, 2005
Grant Date -
Jul 3, 2003
app pub date -
Mar 30, 2001
filing date -
Mar 31, 2000
priority date (Note) -
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Abstract
A method for manufacturing electrical connecting elements or semifinished products. Microvias are formed in a dielectric substrate layer by piercing a substrate layer (1) through a first conducting layer (3), which essentially covers an entire side of the substrate. The perforation depth (d) is at least equal to the total thickness of the substrate and the first conducting layer. The conductor material of the first conducting layer (3), during the piercing step, is deformed so that it partially covers the wall of the hole fabricated by the piercing process. Plating the first conducting layer with additional conductor material bridges the little remaining distance between the conductor material and the opposite side of the substrate layer.
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