Method and device for assembling substrates

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6953514
APP PUB NO 20040055701A1
SERIAL NO

10250794

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method and apparatus for joining at least two substrates together, especially to form an optical data carrier, are provided. Substrates are disposed in a spaced-apart manner between two plates that are disposed opposite from, and are movable relative to, one another. At least one of the plates is connected to a flexible membrane. At least the plate to which the flexible membrane is connected is moved in such a way that a pressure difference is produced on opposite sides of the membrane.

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Patent Owner(s)

Patent OwnerAddress
STEAG HAMATECH AG75447 STERNENFELS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Leonhardt, Stephan Bretten, DE 4 6
Speer, Ulrich Eisingen, DE 9 12

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