Device for thermal treatment of substrates
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United States of America Patent
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Oct 11, 2005
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N/A
app pub date -
Jan 19, 2001
filing date -
Jan 28, 2000
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Abstract
The aim of the invention is to reduce the formation of scratches in a device for the thermal treatment of substrates, in particular, semiconductor substrates, in a chamber in which the substrate is placed upon support elements. According to the invention, said aim is achieved by means of displaceable support elements.
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