Laminates for encapsulating devices
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United States of America Patent
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Sep 27, 2005
Grant Date -
N/A
app pub date -
Jul 9, 1999
filing date -
Jul 9, 1999
priority date (Note) -
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Abstract
An encapsulation for an electrical device is disclosed. The encapsulation comprises plastic substrates which are laminated onto the surface of the electrical device. The use of laminated plastics is particularly useful for flexible electrical devices such as organic LEDs.
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