Arrangement enabling a liquid to flow evenly around a surface of a sample and use of said arrangement

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United States of America Patent

PATENT NO 6949172
SERIAL NO

10069177

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention relates to an arrangement enabling a liquid (2) to flow evenly around a surface of a sample (3); said arrangement has a flow chamber (1) through which a liquid (2) flows via inflow and outflow pipes (7, 8). The sample (3) can be rotated about an axis of rotation by means of a rotary drive (5). A filter (13) which extends crosswise to the direction of flow of the liquid (2) and which ensures a uniform flow through the inflow and outflow pipes (7, 8) is situated in front of the inflow and outflow pipes (7, 8). The arrangement is especially suitable for depositing a homogeneous layer of a nickel/iron alloy on a silicon wafer (3). The invention relates furthermore to the use of the arrangement.

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Patent Owner(s)

Patent OwnerAddress
TYCO ELECTRONICS LOGISTICS AGAMPERSTRASSE 3 STEINACH/SG CH 93

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hosten, Daniel Handzam, BE 16 146
Schmidt, Helge Speyer, DE 76 437
Schwab, Michael Markdorf, DE 34 260

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