Deformation measuring method and apparatus using electronic speckle pattern interferometry
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United States of America Patent
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Sep 13, 2005
Grant Date -
Mar 25, 2004
app pub date -
Jan 2, 2003
filing date -
Sep 20, 2002
priority date (Note) -
Expired
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Abstract
A deformation measuring method using electronic speckle pattern interferometry comprises the steps of subtracting an average intensity from the intensity in a time domain at each point of a speckle pattern image so as to compute the cosine component of intensity; subjecting the cosine component to Hilbert transform in a temporal domain so as to compute the sine component of intensity; determining the arctangent of the ratio between thus computed sine and cosine components so as to determine an object phase; carrying out an unwrapping operation; and outputting three-dimensional deformation distribution data in a displayable mode.
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