Packaging system for power supplies
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 13, 2005
Grant Date -
N/A
app pub date -
Feb 27, 2003
filing date -
Feb 27, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A packaging system for a high current, low voltage power supply. The power supply uses two bare die field effect transistors whose input and output electrodes are solder attached to low resistance, high current posts in the package. An associated controller chip is mounted to a rigid circuit board, and the circuit board is mechanically attached to the posts. The circuit board thereby gives physical rigidity to the package, but carries no high currents. The use of low resistance, high current posts reduces the heat generated, improving the long term reliability.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully