Fluororesin fiber paper, copper-clad laminate for printed board using the same and production process thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 13, 2005
Grant Date -
Feb 6, 2003
app pub date -
Jul 31, 2002
filing date -
Aug 2, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention provides fluororesin fiber paper excellent in adhesion to a copper foil, heat resistance, chemical resistance, low water absorption and electric insulation and capable of being used as a substrate of a printed board suitable for use in high frequency, of which a low dielectric loss is required. The fluororesin fiber paper is a porous sheet obtained by forming a slurry comprising fluororesin fiber into a sheet by a wet paper making method and sintering the resultant sheet and has an average pore diameter of 0.5 to 50 μm and a maximum pore diameter of at most 250 μm. A copper-clad laminate for printed board is produced by laminating the fluororesin fiber paper and a copper foil having a ten point mean height of surface roughness profile (Rz) of 0.5 to 8.0 μm on each other by means of vacuum hot pressing.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully