Apparatus and method for circuit board liquid cooling
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United States of America Patent
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Sep 13, 2005
Grant Date -
Sep 25, 2003
app pub date -
Mar 25, 2002
filing date -
Mar 25, 2002
priority date (Note) -
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Abstract
A circuit board cooling system employs a closed liquid delivery system to transfer heat from integrated circuits to a cooling liquid. The system includes one or more cooling panels that may be attached to a circuit board. Each cooing panel includes at least one channel for the circulation of cooling liquid stamped into a thermally conductive material. Each panel may include multiple levels in order to conform to the profile of integrated circuits to be cooled.
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